Cognichip’s approach is to develop a physics-informed foundation model that achieves more parallelism than is available in ...

A new technical paper titled “Reduced Topography After Stop on Nitride (SON) STI CMP Through Improved Post-Bulk Planarity for ...

AMD is grabbing share from Intel in x86 data center processors at a rapid rate. As the chart above shows, AMD’s share is now ...

Designing Data Centers for Next-Gen Language Models” was published by Intel Corporation and Georgia Tech. An excerpt from the ...

New architectures and manufacturing methods draw investors; 75 startups raise $1.9 billion.

Evaluating CPU Fuzzers via Automatic Bug Injection” was published by researchers at ETH Zurich. Abstract “Hardware fuzzing has recently gained momentum with many discovered bugs in open-source RISC-V ...

A Photonic SRAM with Embedded XOR Logic for Ultra-Fast In-Memory Computing” was published by researchers at University of Wisconsin–Madison and USC. Abstract “Traditional von Neumann architectures ...

Advanced packaging is becoming a key differentiator for the high end of the mobile phone market, enabling higher performance, ...

Heterogeneous integration is a key enabler of today’s AI innovations. By bringing together multiple chips with different ...

Employing more stress testing at the wafer level improves quality while reducing burn-in time and cost. So why isn’t it ...

Next-generation optical inspection is about more than just sensitivity. It’s about reliably seeing through complexity.

The 62 nd DAC showcased numerous new exhibitors in 2025, including tool and IP providers, design services firms, and ...